This listing was posted on ApplicantPro, TalentPlusHire.
Photonics Packaging Engineer
Location:
Saint Louis, MO
Description:
DeepSight Technology Inc . is a rapidly growing startup company that has developed breakthrough technology in ultrasound imaging. This new technology will both extend the range and clarity over current systems by 10x - 100x! We are setting new standards that will dramatically improve the capabilities of ultrasound for many years. In order to develop and improve this technology, we need dedicated team players on our side. Not only do we offer a great team-oriented environment, but we also offer competitive compensation of $75K to $200K per year and generous benefits in both our Clayton, MO (a suburb of St. Louis) and Santa Clara, CA offices. Job Description In photonics, the packaging design is as crucial as the photonic integrated circuit (PIC) design. This is especially true when the product interfaces and interacts with the physical world. In this role, as a member of a multi-disciplinary product development team, you will own the packaging development from concept to production for state-of-the-art photonic integrated circuits. You will be also involved in integrating photonics components with other modules in the system. This position will be looking for someone who can design, develop, and validate a low-cost, high-performance, and reliable packaging platform for photonics components and system integration. Responsibilities include: Conceive novel concepts for low-loss and low-cost fiber packaging through optical/mechanical design and modeling of photonic chip coupling interfaces Simulate the performance of optical assemblies, with a mind towards the interface between PICs and package, as well as manufacturing tolerances. Characterize and qualify the developed packaging solution (optical/mechanical/reliability) with device and systems engineers. Work with contract manufacturers to define design rules for manufacturing. Document and report to internal members and communicate with external vendors and partners Qualifications BS or above a relevant technical field (Optics, Mechanical, Electrical, Materials Science, Applied Physics, or similar) 5+ years of hands-on experience in packaging fiber-coupled devices and photonics integrated circuits chips. Experience designing for manufacturability and automated assembly and characterization Knowledge of fiber-optical systems and optical polymers Experience with 3D printing and/or CNC machining is preferred Ability to read and interpret engineering specifications, drawings, manufacturing instructions, and technical analyses. Industry experience creating detailed design documentation (specifications, design descriptions, verification, and testing plans). Other Qualities We Are Looking For Positive - a can-do attitude that helps you rise to challenges Collaborative - a team player who can effectively communicate with others Attentive to detail - nothing gets by you Efficient - a knack for effectively prioritizing tasks and managing your time Pride in your work - real desire to do quality work Career-minded - looking for more than a job Benefits and Perks We offer great benefits and perks: Competitive salary Stock options Medical, dental, and vision insurance 401(k) retirement plan Locations: 63101, 95051 Job Posted by ApplicantPro
Company:
Deepsight Technology
Posted:
May 1 on ApplicantPro, TalentPlusHire
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More About this Listing: Photonics Packaging Engineer
Photonics Packaging Engineer is a Engineering Engineer Job at Deepsight Technology located in Saint Louis MO. Find other listings like Photonics Packaging Engineer by searching Oodle for Engineering Engineer Jobs.
Photonics Packaging Engineer is a Engineering Engineer Job at Deepsight Technology located in Saint Louis MO. Find other listings like Photonics Packaging Engineer by searching Oodle for Engineering Engineer Jobs.